A chip-level floorplan is about ?
A: Core size, shape and placement row
B: IO, power, corner and filler pad cell locations
C: Macro cell placement
D: Standard cell placement constraints (blockages)
E: Power grid (rings, straps, rails)
F: Routing
A: Core size, shape and placement row
B: IO, power, corner and filler pad cell locations
C: Macro cell placement
D: Standard cell placement constraints (blockages)
E: Power grid (rings, straps, rails)
F: Routing
举一反三
- 选择填空，创建一个包含两行两列的表格。 row 1, cell 1: <>row 1, cell 2 <> row 2, cell 1 row 2, cell 2
- PCB元件布局的设计规则,属于哪个设计规则? A: Routing B: Electrical C: Manufacturing D: Placement
- 下列哪些参数修改是立即生效的？（） A: ACell Transmit Power B: BSwitch for Removing Neighboring Cell C: CMaximum Cell Number reported D: DTracking Area Code
- 下列定义类的格式，和创建对象格式正确的是（） A: public class Cell{ private int row; int col; public void getCellInfo(){System.out.println(row+":"+col); }} B: 创建对象的格式：Cell c=new Cell(); C: public class Cell(){ private int row; int col; public void getCellInfo(){System.out.println(row+":"+col); }} D: 创建对象的格式：Cell c=new Cell;
- Islet can be divided into ( ) cells by staining. A: Islet A cell B: Islet B cell C: Islet C cell D: Islet D cell E: Islet PP cell