Chip scale packaging(CSP) has an IC package that is about the same size as the silicon chip (＜( ) times the footprint of the die) A: 1 B: 1.2 C: 1.5 D: 2

Memory chip could be _____________ A: RAM B: ROM C: microprocessor chip D: flash memory

How to make a chip？

We can call a chip as ________. A: sillicon chip B: carrier package C: integrated circuit D: semiconducto

We can call a chip as __________ A: Silicon chip B: Carrier package C: Integrated circuit D: semiconducto

There are analog-to-digital and digital-to-analog chips, DSP chip, microprocessor chip, ROM and flash memory chips, and other chips on the circuit board.

Chip scale packaging(CSP) has an IC package that is about the same size as the silicon chip (＜( ) times the footprint of the die)

We can call a chip as __________

Some parts of metal furniture are most suitable for stamping and bending, which is a typical non chip and less chip processing technology.

Which of the following statements is best supported by the text A: This chip has been proven to be very successful. B: The use of this chip will be favored by everybody. C: There will be a great market for chip planting in humans. D: Dc0tors will make good money by using chips.