• 2022-06-10 问题

    设计元件封装时,封装的图形及文字符号一般应该放置在哪个层: A: Keep Out Laye B: TOP Laye C: Top Over Laye D: Bottom Laye

    设计元件封装时,封装的图形及文字符号一般应该放置在哪个层: A: Keep Out Laye B: TOP Laye C: Top Over Laye D: Bottom Laye

  • 2022-07-26 问题

    下列层中,哪个在 PCB 中没有电气意义( ) A: Topover Laye B: Bottom Laye C: Top Laye D: Power Plane

    下列层中,哪个在 PCB 中没有电气意义( ) A: Topover Laye B: Bottom Laye C: Top Laye D: Power Plane

  • 2022-07-26 问题

    下列层中,哪个在 PCB 中没有电气意义(0.6) A: Power Plane B: Top Laye C: Bottom Laye D: Topover Laye

    下列层中,哪个在 PCB 中没有电气意义(0.6) A: Power Plane B: Top Laye C: Bottom Laye D: Topover Laye

  • 2022-10-27 问题

    绘制音乐芯片封装库文件时,绘制芯片边框需要切换至哪一板层? A: Top Laye B: TopOver Laye C: Bottom Laye

    绘制音乐芯片封装库文件时,绘制芯片边框需要切换至哪一板层? A: Top Laye B: TopOver Laye C: Bottom Laye

  • 2022-07-26 问题

    设计PCB元件时,元件的外形轮廓绘制在(0.6) A: Multi laye B: Top Overlaye C: TopLaye D: Bottom Laye

    设计PCB元件时,元件的外形轮廓绘制在(0.6) A: Multi laye B: Top Overlaye C: TopLaye D: Bottom Laye

  • 2022-07-02 问题

    Alto stands for ___ . A: ain B: high C: laye D: cirrus

    Alto stands for ___ . A: ain B: high C: laye D: cirrus

  • 2022-06-06 问题

    a sheet of glass A: laye B: pane C: piece of pape D: edclothes

    a sheet of glass A: laye B: pane C: piece of pape D: edclothes

  • 2022-07-29 问题

    板层的英文名称为() A: footprint B: laye C: vi D: pad

    板层的英文名称为() A: footprint B: laye C: vi D: pad

  • 2022-06-17 问题

    The lake was covered with a sheet of ice. A: laye B: pane C: piece of pape D: edclothes

    The lake was covered with a sheet of ice. A: laye B: pane C: piece of pape D: edclothes

  • 2022-06-18 问题

    You can make photos you take on your phone look nice by adding a ______. ( A: laye B: filte C: screen D: melody

    You can make photos you take on your phone look nice by adding a ______. ( A: laye B: filte C: screen D: melody

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